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Brochures and DataSheets

• Advanced Cooling Solutions
• Heat Pipe: Frequently Asked Questions
• HP-1 Heat Pipe
• Mold Cooling Solutions

Technical Papers

• Alleviating Thermal Spreading Resistance in Telecommunications Cooling
• Analysis of a Heat Pipe Assisted Heat Sink
• CFD Modeling of a Therma-Base™ Heat Sink
• Compact, Double Side Impingement, Air-to-Air Heat Exchanger
• Cooling of Power Semiconductors in Cabinets
• Critical Aspects of Modeling Heat Pipe Assisted Heat Sinks
• Effective Board Level Cooling Solutions Using Heat Pipe Technology
• Graphic Processor Thermal Control Design Guide
• Heat Pipe Application Guidelines
• Heat Pipe Reliability Documentation
• Heat Pipes Drive Power Semiconductor Temperatures Down
• High Power Telecom Cooling Case
• Multi-Kilowatt Heat Pipe Heat Sink Performance
• Natural Convection Cooled Heat Pipe Assisted Heat Sinks for Telecommunications Equipment
• Therma-Base™ Heat Sink
• Therma-Base™ Heat Sink Testing Guidelines
• Therma-Base™ Heat Sinks for Microprocessor Cooling
• Therma-Base™ Vapor Chamber Heat Sinks Eliminate Semiconductor Hot Spots
• Use of Vapor Chambers for Thermal Management