Thermacore has a variety of solutions to meet your cooling challenges at the component, board and system level.

Component level solutions - heat pipe assembly coupled to heat generating component via an interface plate to which the heat pipe and condenser fins or block are attached.

Board level solutions – thermal solution coupled to multiple heat generating components typically on a printed circuit board.

System level solutions – thermal solution typically coupled to an enclosure containing multiple components and/or boards.

Our communications-based solutions are capable of cooling equipment in the following product areas:

• Base Stations
• Amplifiers
• Enclosures
• Optical