Thermacore and Modine | Applied Thermal Innovation
Heat Exchanger Technologies

The trend toward greater miniaturization and compactness of electronic components and assemblies has increased the capability to get more electronics into enclosed cabinets. The resulting increased heat loads have placed greater demands on cabinet cooling to ensure that electronics are protected while performing as intended. Thermacore offers a family of compact, high-efficiency cabinet-cooling heat exchanger technologies that are capable of meeting the increasing thermal requirements.


Heat Pipe Heat Exchanger Core Technology

Heat pipe core units are a flexible thermal management system used to interface with duct work and other customized applications. Fin stacks can be tailored to accommodate different air velocities in the ambient and internal loops. All heat pipe core units provide a NEMA 4 and NEMA 12 compliant seal to separate the two air streams. Our engineers can design a broad range of core sizes for your application.


Folded Fin Core Technology

 Our folded fin heat exchanger cores provide air-to-air cooling, allowing isolation between internal and external air streams. This prevents outside elements such as dirt or dust from entering the system. Advanced two-piece construction also requires less sealing, resulting in a more reliable installation. All-aluminum construction enhances thermal conductivity with a lightweight design, promoting more efficient operation. Superior air flow performance makes the product ideally suited for electronic cabinet cooling applications.


Liquid-to-Air Core Technology

 Our liquid-to-air heat exchanger cores provide increased effectiveness. These cores improve system efficiency with lower head pressures and smaller heat exchanger size while reducing volume and liquid charge. The shallower depth reduces the air-side pressure drop resulting in reduced fan noise and power, while its lower weight and thermal mass improve system response time.

We offer two types of liquid-to-air heat exchanger cores — an all-aluminum heat exchanger core featuring Modine’s patented PF™ Parallel Flow technology for high performance, and a low-cost, copper tube/aluminum fin heat exchanger core solution.

PF™ Parallel Flow brazed aluminum liquid-to-air heat exchangers are designed for applications requiring high performance from a compact package. They are constructed using aluminum tubes and fins for high-thermal conductivity. Micro-channel tube passages increase the liquid-side heat transfer coefficient. Flat tubes with short fins increase the air-side heat transfer coefficient and lower resistance to air flow.

Modine’s copper tube, aluminum fin heat exchanger cores are used in a wide range of applications to transfer heat between air and fluid. These coils set the highest standards of cost-effective heat transfer.


HX™ Series Compact Heat Exchanger

 HX™ Series Heat Exchangers are designed to provide economical cooling for enclosed electronic equipment with high heat loads. The HX™ Series utilizes passive heat pipe technology with energy-efficient cooling fans for economical operation and high operational reliability. Their design allows for placement on the doors, side, top, or back of the enclosure.

As an air-to-air heat exchanger, the HX series utilizes two-phase heat pipe technology for performance, reliability and cost effectiveness. They are an efficient heat transfer system that enables multiple packaging options. The HX™ maintains NEMA 4 and NEMA 12 integrity by utilizing a flange and a closed-cell neoprene gasket between the unit’s interior and exterior heat exchanger. Product design can easily be scaled to larger or smaller capacity configurations and can be equipped with either AC or DC fans.

HX™ heat pipe heat exchangers are easily adaptable for custom applications and can be mounted externally, partially recessed or captured within ductwork.


HXc™ Series Heat Exchanger

   We recommend our high-capacity, cross-flow HXc™ heat exchanger for applications exceeding 2,000W. The HXc™ is designed with effective, space-efficient, cross-flow plate heat exchanger cores that can be customized for today’s OEM applications. Units can be equipped with alarms, heaters and temperature controls. These units are manufactured to meet Bellcore GR-487-CORE, NEMA 4 and NEMA 12 requirements

The HXc™ series is the efficient and cost-effective answer to large scale, high-power enclosure cooling for communications, industrial and OEM applications.


HXi™ Series Heat Exchanger

  Our HXi™ Series air-to-air heat exchangers are designed primarily for cooling indoor and outdoor electronic enclosures. They use a double-sided impingement technology to significantly improve heat transfer performance while reducing heat exchanger size. Tests verify that the HXi™ heat exchanger is capable of dissipating twice the heat load of competitive heat exchangers at a comparable size.

Thermacore’s patented design makes the HXi™ Series a low-cost and high-performance alternative to conventional heat exchanger technologies. There are fewer moving parts for greater overall reliability. Standard units are available with 2, 4, 6 or 8 fans. Custom optional features such as alarms and temperature controls are also available. Units are UL recognized and meet Bellcore GR-487-CORE, NEMA 4 and NEMA 12 requirements.


Hybrid Heat Exchanger Technology

The Hybrid Heat Exchanger is a combined component/system solution providing cooling to the enclosure and high-heat dissipating components in a unified package. It is a liquid-to-air system capable of multi-kilowatt heat loads and offers highly efficient cooling for high heat flux components. The Hybrid provides full electronic control of heat transfer functions and can be designed to meet Bellcore, UL and NEBs.

The Hybrid Heat Exchanger utilizes two separate cooling loops: one for cooling components directly and one to cool remaining residual heat loads within the cabinet. The pumped liquid system is coupled to heat-generating components via a liquid-cooled plate, to which the components are attached. The coolant is re-circulated in the system and heat is rejected by the liquid-to-air heat exchanger.