Liquid Cooling System

 Our Liquid Cooling System (LCS) is a sealed system that utilizes pumped single-phase liquid to cool computer microprocessors. The LCS uses a pump to circulate a thermally conductive liquid that removes heat from the processor and rejects it to the ambient air flowing through a liquid-to-air heat exchanger.

We have incorporated our patented sintered powder metal technology into the cold plate component. Micro-channel cold plates can be used for applications with lower performance requirements. The all-aluminum, liquid-to-air heat exchanger builds on Modine’s patented PF™ Parallel Flow technology and higher heat flux capability, maximizing heat transfer efficiency by dissipating excess microprocessor heat into the local ambient air.