Therma-Sink™ uses heat pipe technology to move heat from an attachment plate at the heat source to a location within the package where enough air volume exists for adequate heat removal. Designed for applications with limited space directly above the component, multiple assemblies can be used to transfer heat to a common airflow. The Therma-Sink™ assembly can be located above, below or on the same level as the heat source.
High-Power Heat Pipe Technologies
Therma-Charge™ uses standard heat pipes embedded in a metal plate and extending from the plates to a remote fin stack, where heat is rejected by natural or forced convection. These assemblies are typically used for cooling power semiconductors in motor drive assemblies and other applications.
Isolated Therma-Charge™ units are designed for electrical isolation and can insulate several thousand volts of electricity. Different sizes and configurations of the Therma-Charge™ and Isolated Therma-Charge™ along with custom solutions are available.
Tower Heat Pipe Technology
In a Therma-Tower™ the base plays an integral role. A significant thermal interface between the heat source and the air is eliminated due to the base’s wick structure, allowing higher heat flux loads to be handled. The vertical fin stack along the outside of the heat pipe results in maximum heat dissipation with the smallest footprint.
Embedded Heat Pipe Technology
Embedding heat pipes into a heat sink is an effective cooling alternative, enhancing the performance of existing heat sinks with minimal design changes. Inserting heat pipes into grooves in a heat sink base can reduce a heat sink’s thermal resistance up to 50%.
Loop Thermosyphon Technology
Therma-Loop™ is a loop heat pipe which contains no wick structure in the liquid and vapor lines. In its simplest configuration, the Therma-Loop™ is gravity aided and has no wick structure. This technology is utilized where length from the heat source to the condenser is not feasible for conventional heat pipes.
Vapor Chamber Technology
Therma-Base™ is a vapor spreader used as the base of a heat sink. A Therma-Base™ delivers higher performance than a traditional heat sink by alleviating spreading resistance typically found in solid heat sinks. The Therma-Base™ has an enhanced capability to accept higher heat fluxes than a traditional aluminum or copper surface. Additionally, its smaller size improves system packaging and provides quieter operation, at a reduced weight.
Overview
Therma-Sink™ uses heat pipe technology to move heat from an attachment plate at the heat source to a location within the package where enough air volume exists for adequate heat removal. Designed for applications with limited space directly above the component, multiple assemblies can be used to transfer heat to a common airflow. The Therma-Sink™ assembly can be located above, below or on the same level as the heat source.
Therma-Charge™ uses standard heat pipes embedded in a metal plate and extending from the plates to a remote fin stack, where heat is rejected by natural or forced convection. These assemblies are typically used for cooling power semiconductors in motor drive assemblies and other applications.
Isolated Therma-Charge™ units are designed for electrical isolation and can insulate several thousand volts of electricity. Different sizes and configurations of the Therma-Charge™ and Isolated Therma-Charge™ along with custom solutions are available.
In a Therma-Tower™ the base plays an integral role. A significant thermal interface between the heat source and the air is eliminated due to the base’s wick structure, allowing higher heat flux loads to be handled. The vertical fin stack along the outside of the heat pipe results in maximum heat dissipation with the smallest footprint.
Embedding heat pipes into a heat sink is an effective cooling alternative, enhancing the performance of existing heat sinks with minimal design changes. Inserting heat pipes into grooves in a heat sink base can reduce a heat sink’s thermal resistance up to 50%.
Therma-Loop™ is a loop heat pipe which contains no wick structure in the liquid and vapor lines. In its simplest configuration, the Therma-Loop™ is gravity aided and has no wick structure. This technology is utilized where length from the heat source to the condenser is not feasible for conventional heat pipes.
